Survey of Reliability Research on 3D Packaged Memory

As the core carrier of information storage, a semiconductor memory device is basic product with large volume that widespread in integrated circuit industry. With rapid development manufacturing processes and materials, internal structure has gradually shifted from 2D planar packaging to 3D meet industry demands for high-frequency, high-speed, large-capacity devices low power consumption. However, advanced technology can pose some reliability risks, making prone failure, especially when used harsh environmental conditions, including temperature changes, high humidity levels, mechanical stress. In this paper, authors introduce typical characteristics packaged memory; analyze reasons failure caused by stress; summarize current research methods utilize temperature, hygrothermal theories, models; present future challenges directions regarding memory.